SHENZHEN, China-Tuesday 29 June 2021 [ AETOS Wire ]
(BUSINESS WIRE) -- Fibocom (Stock Code: 300638), a leading global provider of IoT (Internet of Things) wireless solution and wireless communication modules, today announces the joint release of the FM350 5G wireless module. Partnered with Intel and MediaTek, Fibocom’s FM350 is designed to offer high-speed 5G wireless connectivity for better PC platform support and user experience.
Based on the
MediaTek T700 chipset platform, Fibocom’s FM350 module supports the 5G
NR Sub-6 band with up to 4.67 Gbps on the downlink and 1.25 Gbps on the
uplink theoretically.
Supporting 5G standalone network (SA) and
non-standalone (NSA) network architectures, the Fibocom FM350 5G module
is backward compatible with LTE/WCDMA network standards, which helps to
reduce complexity in end product configuration.
Fibocom’s FM350
module is ideally suitable for PCs (laptop, desktop, tablet, etc.), and
it supports Windows, Linux and Chrome operating systems. Designed with
standard M.2 form factor, the module has various interfaces, including
PCIe 3.0, USIM, I2C, Body SAR, MIPI Tuner, tunable antenna, etc.,
unleashing the potential of cellular technology to meet high speed
bandwidth application demand. In addition, FM350 has a built-in eSIM,
providing end users the flexibility to select carrier profiles. It also
supports GNSS, including GPS, GLONASS, BeiDou, and Galileo.
The
Fibocom FM350 module is globally certified by regional regulatory
bodies, mainstream carriers, industry institutions, and has obtained
approval from several technical certification laboratories.
“We
are very excited to partner with Intel and MediaTek to deliver a new
generation of 5G solution for PC. Based on the MediaTek T700 chipset,
Fibocom’s FM350 5G module is an excellent step forward in the
proliferation of 5G in PC, allowing users to seamlessly connect to the
5G networks worldwide. The module is an excellent addition to our 5G
wireless module family, enabling the high-bandwidth and secure PC
experience brought by 5G technology,” said Tiger Ying, CEO, Fibocom.
“Intel
strives to deliver the best possible experience across all of our
mobile computing platforms. With anytime, anywhere wireless access
coupled with multi-gigabit speeds (where available), 5G technology
enables Modern Connected PC users to stay productive and enjoy
next-generation applications.1 We are delighted to collaborate with
Fibocom and MediaTek to launch the new Intel® 5G Solution 5000.
Together, we provide leading 5G capabilities for our latest 11th Gen
Intel® Core™ mobile platforms,” said Eric A. McLaughlin, VP Client
Computing Group & GM Wireless Solutions Group, Intel Corporation.
“MediaTek’s
T700 is helping to redefine the next generation of PC experiences. With
our groundbreaking 5G modem technology, the new module will deliver
connected experiences to consumers everywhere at unparalleled data
speeds, unleashing more potential for productivity, gaming, and even
entertainment whether users are at home or on the go,” said Dr. JC Hsu,
Corporate VP and GM of MediaTek’s Wireless Communications Business Unit.
“We look forward to continuing to work with Intel and Fibocom to bring
the latest 5G technologies to consumers around the world.”
About Fibocom
Fibocom
is a leading global provider of wireless communication modules and
solutions in the sector of IoT (Internet of Things), as well as the
first stock-listed (Stock Code:300638) wireless module provider in
China. We provide end-to-end IoT wireless communication solutions for
telecom operators, IoT equipment manufacturers, and IoT system
integrators. With over two decades' engagement in M2M and IoT
communication technology and extensive expertise, we are capable of
independently developing high-performance wireless communication modules
including 5G, LTE/LTE-A, NB-IoT/LTE-M, Android Smart, Automotive,
WCDMA/HSPA(+), GSM/GPRS, Wi-Fi, GNSS, etc. Besides reliable, convenient,
safe, and intelligent IoT communication solutions for almost all
vertical industries, we are also geared to customize the best and
optimal IoT modules and solutions catering to your special requirements.
1 Visit www.intel.com/PerformanceIndex (connectivity) for more information
View source version on businesswire.com: https://www.businesswire.com/news/home/20210628005274/en/
Contacts
Media
Ellie Cai
pr@fibocom.com
+86 755-26733555
www.fibocom.com
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